- Panel size 510mm x 515 mm and beyond
- Cu, Ti, Al, Ni, barrier/seed stacks
Prior to Samba, founders had successfully built ‘Tango’ and the first panel PVD System for Panel Level Packaging (PLP), which was acquired by AMAT
Samba Team has extensive knowledge and experience serving PLP market
- Lower cost of development
- Customer trust in team and technology
- Lower cost of ownership (>30%)
- Time to Market
- Higher productivity >30%
PVD PLP
- Modular PVD platform built for panels (e.g., 510mm x 515 mm and beyond)
- High-uniformity, low-temp sputtering with in-situ pre-clean
- Proprietary design for warpage control and minimal/no edge exclusion
- Flexible for Cu, Ti, Al, Ni, barrier/seed stacks
PVD PLP Timeline
- 2025: Alpha tool demo + customer engagement
- 2026: Beta site validation + production ramp
- 2028+: Next-gen panels, new materials (glass, organic interposers), passives integration
Enabling Scalable Panel-Level Packaging with High Productivity, Low Cost, and Thin Glass Innovation