- RDL / UBM
- Hybrid bonding
- TSV metallization
- Bond pads
Key Platform Capabilities
- §Staged Vacuum Architecture: Enables ultra-high vacuum (UHV) performance for demanding PVD processes.
- §Flexible 10-Module Configuration: Supports up to ten process modules with customizable tool layouts tailored to specific application needs.
- §Scalable Modular Design: Easily expandable to accommodate future process modules or new capabilities.
High Throughput. Modular. Scalable. Engineered for Unmatched On-Wafer Performance